发明名称 IMAGING APPARATUS AND METHOD OF MANUFACTURING CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide an imaging apparatus which is made compact and yet can be easily assembled and handled. <P>SOLUTION: The imaging apparatus includes: an objective optical system 8; an imaging device 14 to capture an optical image formed by the objective optical system 8; circuit boards 16, 17, 18, 19 on which the imaging device 14 is mounted and to which a signal cable 38 is connected; and a cylindrical casing 5 to store the objective optical system 8, imaging device 14, and the circuit boards 16, 17, 18, 19. The circuit boards 16, 17, 18, 19 are composed of two or more circuit boards and each of the circuit boards 16, 17, 18, 19 is laminated in the radial direction of the casing 5. Widths of the respective laminated circuit boards 16, 17, 18, 19 in the short hand direction of the casing 5 are formed narrower in order from the center of the casing 5 in the radial direction to the outside in the radial direction. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012147968(A) 申请公布日期 2012.08.09
申请号 JP20110009209 申请日期 2011.01.19
申请人 SUWA OPTRONICS:KK 发明人 OYUKI NAOYA;SAKAI GODAYU
分类号 A61B1/04;A61B1/00;G02B23/24;G03B15/00;G03B17/02;H04N5/225 主分类号 A61B1/04
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