FABRICATION METHOD OF SELF-ALIGNED CHANNEL FOR TRENCH-GATE ACCUMULATION-MODE SIC MOSFET
摘要
<p>PURPOSE: A fabrication method of a self-aligned channel for a trench-gate accumulation-mode SIC(Silicon Carbide) MOSFET(Metal Oxide Semiconductor Field Effect Transistor) is provided to form an n-base layer having a predetermined thickness by self-aligning a gate trench and a p-base layer with a single photographing work. CONSTITUTION: A low concentration n-type drift layer(610) is formed on a high concentration N type substrate(600). An N-base layer(620) is formed on the low concentration n-type drift layer. A source layer(630) is formed on the N-base layer. A polysilicon layer(640) is formed on the source layer. A silicon nitride film(650) is formed on the polysilicon layer.</p>
申请公布号
KR101172796(B1)
申请公布日期
2012.08.09
申请号
KR20110060811
申请日期
2011.06.22
申请人
KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE
发明人
KANG, IN HO;KIM, NAM KYUN;KIM, SANG CHEOL;MOON, JEONG HYUN;BAHNG, WOOK;JOO, SUNG JAE