| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a heat sink which suppresses thermal stress applied to a bonding member and maintains high cooling performance even after repetition of temperature cycle, and to provide a semiconductor device which operates stably when a semiconductor module is cooled by this heat sink. <P>SOLUTION: The hollow and flat heat sink which absorbs heat from heat generating bodies 1 bonded, respectively, to both outer surfaces by a cooling medium flowing internally comprises two flat plates 31A, 31B placed to face each other at a predetermined interval so that the outer surfaces become the bonding surfaces to the heat generating bodies, i.e. semiconductor modules, and fins 34A, 34B formed, respectively for two flat plates 31A, 31B, to extend from the internal surface of a flat plate toward the opposing flat plate, and to form a heat transfer surface to the cooling medium flowing between the two flat plates, where at least a part of the tip is the free end. <P>COPYRIGHT: (C)2012,JPO&INPIT |
