发明名称 MOLD STRUCTURE AND BUMPER
摘要 A mold structure used to form a molded object having an undercut portion includes a fixed mold as a first mold having a first molding surface for molding an obverse surface of the molded object; a slide core having an undercut molding surface used to mold the undercut portion as part of the obverse surface of the molded object; and a movable mold as a second mold having a second molding surface used to mold the reverse surface of the molded object. The first molding surface and the undercut molding surface form a cavity surface. A step is formed between the first molding surface and the second molding surface at a parting position between the fixed mold and the slide core on the cavity surface.
申请公布号 US2012200097(A1) 申请公布日期 2012.08.09
申请号 US201013503342 申请日期 2010.10.18
申请人 SETO HIDEYUKI;SHIMADA SHINICHI;HANADA SHINICHI;IZUMI AKIRA;SASAKI SUMIO;TOYOTA JIDOSHA KABUSHIKI KAISHA 发明人 SETO HIDEYUKI;SHIMADA SHINICHI;HANADA SHINICHI;IZUMI AKIRA;SASAKI SUMIO
分类号 B60R19/02;B29C45/17 主分类号 B60R19/02
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