发明名称 |
MOLD STRUCTURE AND BUMPER |
摘要 |
A mold structure used to form a molded object having an undercut portion includes a fixed mold as a first mold having a first molding surface for molding an obverse surface of the molded object; a slide core having an undercut molding surface used to mold the undercut portion as part of the obverse surface of the molded object; and a movable mold as a second mold having a second molding surface used to mold the reverse surface of the molded object. The first molding surface and the undercut molding surface form a cavity surface. A step is formed between the first molding surface and the second molding surface at a parting position between the fixed mold and the slide core on the cavity surface.
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申请公布号 |
US2012200097(A1) |
申请公布日期 |
2012.08.09 |
申请号 |
US201013503342 |
申请日期 |
2010.10.18 |
申请人 |
SETO HIDEYUKI;SHIMADA SHINICHI;HANADA SHINICHI;IZUMI AKIRA;SASAKI SUMIO;TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
SETO HIDEYUKI;SHIMADA SHINICHI;HANADA SHINICHI;IZUMI AKIRA;SASAKI SUMIO |
分类号 |
B60R19/02;B29C45/17 |
主分类号 |
B60R19/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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