| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device capable of promoting heat radiation from an LED chip and improving luminous efficiency. <P>SOLUTION: A semiconductor light emitting device A1 comprises a plurality of LED chips 5 and a case 2. An anode electrode conducting a p-type semiconductor layer of the LED chip 5 and a cathode electrode conducting an n-type semiconductor layer are formed on the case 2 side. The case 2 has a substrate 3 made of ceramic; and wiring 4 having a surface layer 41 including a plurality of anode pads and cathode pads formed on a surface 31, a rear surface layer 43 including an anode mounting electrode 43a and a cathode mounting electrode 43b formed on a rear surface 32, a plurality of anode penetrating wires 44 conducting the plural anode pads with the anode mounting electrode 43a and penetrating through at least one part of the substrate 3 in a thickness direction, and a plurality of cathode penetrating wires 45 conducting the plural cathode pads with the cathode mounting electrode 43b and penetrating through at least one part of the substrate 3 in the thickness direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
