PURPOSE: A method for manufacturing a printed circuit is provided to form a solder resist layer in constant thickness by evenly forming an outer layer circuit on an insulating layer. CONSTITUTION: A solder pattern(120) and a circuit pattern(150) are formed on an insulating layer(110). A solder resist layer(160) is formed on the insulating layer with photocurable resins or thermosetting resins or a mixture of photocurable resins and thermosetting resins. A solder resist used on the solder pattern and a solder resist used on the solder resist layer are formed in different materials to improve coherence of a substrate(100).
