| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide systems and methods for a three-layer chip-scale MEMS device. <P>SOLUTION: Systems and methods for a micro-electromechanical system (MEMS) device are provided. The system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
