发明名称 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To reduce unprofitable treatment of a dummy substrate in treatment for a product substrate even when return treatment is needed. <P>SOLUTION: A substrate treatment method comprises: a performing step of performing first treatment to each of a plurality of substrates and performing second treatment to the substrate after the first treatment; a collecting step of collecting the substrate of each of the plurality of substrates, which has been subjected to the first and second treatment, in an evacuation room; an adjustment step of carrying a dummy substrate into a first treatment chamber after finishing the first treatment to the last substrate in the plurality of substrates, performing third treatment to the dummy substrate and further carrying the dummy substrate out of the first treatment chamber; and a second performing step of carrying the substrate that is collected in the collecting step after the dummy substrate is carried out of the first treatment chamber in the adjustment step, into the first treatment chamber and performing the third treatment. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012151447(A) 申请公布日期 2012.08.09
申请号 JP20110269375 申请日期 2011.12.08
申请人 CANON ANELVA CORP 发明人 EBARA KIYOSHI;SUZUKI MITSUO
分类号 H01L21/677 主分类号 H01L21/677
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