| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high productivity semiconductor module which ensures to connect an exterior shield to ground, prevents short circuits between the exterior shield and signal wiring, and achieves the reduction of the size and the thickness. <P>SOLUTION: A semiconductor module A includes a substrate 1 where an electronic component 2 is mounted on an upper surface, an insulative sealing resin layer 3 sealing the upper surface, a conductive exterior shield 4 covering a surface of the sealing resin layer 3 that is located on the opposite side of the substrate 1, and a connection part 5 which is disposed in the sealing resin layer 3 and electrically connects the exterior shield 4 with a ground terminal 13 included in the substrate 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
