| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip resistor, which can prevent plating from being exposed on a side face part of a product. <P>SOLUTION: The method for manufacturing the chip resistor comprises: a step of forming a resistor 13 between a pair of upper face electrodes 12 on an upper face of an insulating substrate 11; a step of forming a trimming groove 17 by cutting the resistor 13 from a side face 13a of the resistor 13 toward a center direction of the resistor 13 by using a laser to control a resistance value; a step of forming a protection film 14 so as to cover the resistor 13; a step of forming end face electrodes 15 on both end faces of the insulating substrate 11, which are connected to the pair of the upper face electrodes 12; and a step of forming plating layers 16 by plating a surface of the end face electrodes 15. The method further comprises irradiating a region with a laser again, which is located in a vicinity of an initial point 17a of the trimming groove 17 and between the side face 13a of the resistor 13 and a side face 11a of the insulating substrate 11, before the step of forming the protection film 14. <P>COPYRIGHT: (C)2012,JPO&INPIT |
