| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board which can cope with enhancement of wiring density. <P>SOLUTION: The printed wiring board 1 has a substrate 11, a plurality of first interconnections 12 provided on the surface of the substrate 11, and a plurality of second interconnections 13 provided on the rear surface of the substrate 11. A connection 14 is provided between a portion of the first interconnection 12 and a portion of the second interconnection 13 so as not to project from a region where a portion of the first interconnection 12 and a portion of the second interconnection 13 overlap. In the plan view from the substrate surface side, the connection 14 spans a region between a pair of sides in the extension direction of the first interconnection 12, and spans a region between a pair of sides in the extension direction of the second interconnection 13. <P>COPYRIGHT: (C)2012,JPO&INPIT |
