发明名称 PHENOLIC RESIN COMPOSITION, MOLDING MATERIAL MADE OF PHENOLIC RESIN, AND MOLDED ARTICLE MADE OF PHENOLIC RESIN
摘要 <P>PROBLEM TO BE SOLVED: To provide: a phenolic resin composition excellent in moldability, intensity, and dimensional stability under high-temperature high-humidity condition; a molding material made of a phenolic resin; and a molded article made of the phenolic resin. <P>SOLUTION: The phenolic resin composition comprises the phenolic resin and a curing agent, or comprises the phenolic resin, the curing agent, and a curing auxiliary agent. In the phenolic resin composition, 100 mass% of the total mass of the phenolic resin is made up of: 30-60 mass% of alkylbenzene-modified novolak phenolic resin; 10-30 mass% of novolak phenolic resin; 10-50 mass% of polyvinyl acetate-modified novolak phenolic resin; and 10-30 mass% of resol type phenolic resin. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012149128(A) 申请公布日期 2012.08.09
申请号 JP20110007257 申请日期 2011.01.17
申请人 PANASONIC CORP 发明人 HIRABAYASHI TATSUO;MIYOSHI MASANORI
分类号 C08L61/14;C08G8/28;C08K7/14 主分类号 C08L61/14
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