COMPOSITION FOR FILLING DISCHARGING GAP AND ELECTROSTATIC DISCHARGE PROTECTOR

摘要

[Problem] To provide a composition for filling a discharging gap, that composition having excellent application properties (potting properties), and to provide an electrostatic discharge protector that has freedom in shape for electronic circuit substrates with a variety of designs, can conveniently have ESD countermeasures implemented, has superior operating properties during discharge, and can be made small and low-cost by using that composition. [Solution] This composition for filling a discharging gap contains a metal powder (A), a binder composition (B), and a diluting agent (C). The diluting agent (C) is characterized by having two or more characteristic groups and by having these characteristic groups bonded to each other via hydrocarbon groups or silicon atoms without direct bonding within the molecules.