| 摘要 |
A method of sampling semiconductor wafers includes passing a lot of semiconductor wafers into a semiconductor processing tool, processing a first portion of the lot in one process chamber of the semiconductor processing tool and a second portion of the lot in another process chamber of the semiconductor processing tool to produce processed semiconductor wafers, and initiating a wafer sampling engine to select at least one of the processed semiconductor wafers for sampling. The wafer sampling engine computes a long term process capability index for the processing tool and a short term process performance index for at least one of the processing tool and process chamber, identifies at least one desired sampling measurement type, selects the at least one of the processed semiconductor wafers for sampling, and collects the desired measurement types from the at least one of the processed semiconductor wafers selected for sampling. |
