| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method basically improved in consideration of the defect of a method using a laser for a structure formation in a plastic surface and a selective metal plating. <P>SOLUTION: This invention relates to a selective metal plating method for the surface of a plastic substrate and the formed circuit component manufactured by the method. In the method, the plastic substrate contains tectoalumino silicate salt as an additive agent, which is naturally or synthetically manufactured, and the tectoalumino silicate salt is attained by the ablation treatment for the surface of the plastic substrate, then seeding is performed, and finally metal plating is performed without applying electric current from the outside. <P>COPYRIGHT: (C)2012,JPO&INPIT |
