| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for grinding a hard substrate which can grind a hard substrate without damaging the hard substrate. <P>SOLUTION: The method for grinding a hard substrate includes: a holding step of holding the hard substrate by a holding surface of a chuck table; a positioning step of positioning the chuck table at a grinding position; a loose grain grinding step of feeding loose grains to slightly grind the hard substrate when operating a grinder feeding device to bring a grinding wheel into contact with the hard substrate held on the chuck table at a predetermined grinder feeding speed; a grinding step of stopping the feeding of loose grains after the loose grain grinding step, and grinding the substrate while feeding grinding water; and a grinding completion detection step of stopping the grinding when the thickness of the hard substrate reaches a desired thickness. <P>COPYRIGHT: (C)2012,JPO&INPIT |
