发明名称 |
SUBSTRATE STRUCTURES APPLIED IN FLEXIBLE ELECTRICAL DEVICES AND FABRICATION METHOD THEREOF |
摘要 |
A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The disclosure also provides a method for fabricating the substrate structure.
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申请公布号 |
US2012201961(A1) |
申请公布日期 |
2012.08.09 |
申请号 |
US201213449036 |
申请日期 |
2012.04.17 |
申请人 |
LIAO HSUEH-YI;LEU CHYI-MING;SU CHUN-WEI;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
LIAO HSUEH-YI;LEU CHYI-MING;SU CHUN-WEI |
分类号 |
B05D1/36;B05D3/12 |
主分类号 |
B05D1/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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