COOLING STRUCTURE FOR ELECTRONIC DEVICE

摘要

A heat-generating component (3) is mounted on one surface of a circuit board (2); and disposed between this surface and an opposing wall (12) of a housing (1) is a heat-radiating member (4) having a plate (41) that extends along a predetermined direction and contacts the heat-generating component (3), and also having fins (42) that protrude from the plate (41) towards the opposing wall (12). Intake ports (1c) are provided so as to extend along the predetermined direction in that region of the opposing wall (12) of the housing which overlaps the heat-radiating member (4). The heat-radiating member (4) is in contact with the opposing wall (12), with heat-conducting spacers (9) interposed therebetween, on both ends in the predetermined direction, and a gap (8) is formed between the fins (42) and the opposing wall (12).