发明名称 MANUFACTURING METHOD FOR ADHERED MATERIAL, MANUFACTURING METHOD FOR SUBSTRATE HAVING ADHESIVE PATTERN, AND SUBSTRATE HAVING ADHESIVE PATTERN
摘要 <p>A manufacturing method for an adhered material in which a first adherend and a second adherend are bonded via an adhesive pattern, said manufacturing method comprising: a step in which an adhesive layer is provided on the first adherend; a step in which an adhesive pattern is formed by etching the adhesive later after predetermined sections of the surface of the adhesive layer opposite to the surface in contact with the first adherend are provided with a protective layer which protects against etching; and a step in which the second adherend is bonded to the adhesive pattern after the removal of the protective layer.</p>
申请公布号 WO2012105658(A1) 申请公布日期 2012.08.09
申请号 WO2012JP52421 申请日期 2012.02.02
申请人 HITACHI CHEMICAL COMPANY, LTD.;IKEDA AYA;FUJII SHINJIRO;MASUKO TAKASHI;KAWAMORI TAKASHI 发明人 IKEDA AYA;FUJII SHINJIRO;MASUKO TAKASHI;KAWAMORI TAKASHI
分类号 H01L21/52;C09J5/00;C09J201/00;H01L23/02;H01L27/14 主分类号 H01L21/52
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