发明名称 FOAMING MOLDED BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide an foaming molded body which has excellent fatigue resistance to repeated compression. <P>SOLUTION: Regarding the foaming molded body, bubbles are dispersed into a base material resin. The bubbles are formed in such a manner that a thermally expandable microcapsule in which a volatile liquid as a core agent is involved in a shell including a polymer is thermally expanded. The average adhesion index between the shell of the thermally expandable microcapsule after the thermal expansion and the base material resin is &ge;7. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012149173(A) 申请公布日期 2012.08.09
申请号 JP20110008951 申请日期 2011.01.19
申请人 SEKISUI CHEM CO LTD 发明人 YAMAUCHI HIROSHI;NATSUI HIROSHI;MORITA HIROYUKI
分类号 C08J9/32 主分类号 C08J9/32
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