摘要 |
<P>PROBLEM TO BE SOLVED: To improve the uniformity of in-plane temperatures of a substrate when the substrate is processed by heating. <P>SOLUTION: A substrate processing apparatus includes: a processing chamber processing a substrate; a substrate support part supporting the substrate in the processing chamber; a heating part which has multiple heat sources provided facing a substrate support surface of the substrate support part and arranged adjacent to each other so as to be spaced a predetermined distance away from each other; and a filter provided between the heating part and the substrate support part. When the filter transmissivity in a region facing a first heat source group forming an outer periphery of a heat source group composed of the multiple heat sources is referred to as a first transmissivity and the filter transmissivity in a region facing a second heat source group that is different from the first heat source group, out of the multiple heat sources, is referred to as a second transmissivity, the first transmissivity is higher than the second transmissivity. <P>COPYRIGHT: (C)2012,JPO&INPIT |