| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide means being a small three-dimentional mounting type semiconductor device that is produced by combining a plurality of semiconductor devices, by which heat generated from the device is less likely communicated to other semiconductor devices even in the case that a device having a large power consumption is used as the semiconductor device, thus, malfunction of the semiconductor device can be prevented. <P>SOLUTION: A three-dimentional mounting type semiconductor device has: a flexible circuit substrate 3 having a lower side part, an upper side part, and at least one side part; a supporting body 5 supporting the upper side part of the flexible circuit substrate; and at least two devices 1 and 2 mounted on the flexible circuit substrate. At least one of the devices is mounted on an upper face 9 of the lower side part of the flexible circuit substrate. At least another one device is mounted on a lower surface of the upper side part of the flexible circuit substrate. A space is provided between the at least one of the devices mounted on the upper face of the lower side part of the flexible circuit substrate and the at least another one device mounted on the lower surface of the upper side part of the flexible circuit substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
