STRUCTURED GLASS WAFER FOR PACKAGING A MICROELECTROMECHANICAL-SYSTEM (MEMS) WAFER

摘要

A structured glass wafer for packaging a microelectromechanical-system (MEMS) wafer. The structured glass wafer includes a sheet of glass, and an access hole. The sheet of glass has a first side and a second side, and is configured to provide a protective covering for MEMS devices. The access hole extends through the sheet of glass from the first side to the second side of the sheet of glass, and is configured to provide access to a group of electrical contacts of a group of MEMS devices. A packaged MEMS wafer including the structured glass wafer, and a method for fabricating a packaged MEMS wafer are also provided.