TAP TAPE FOR ELECTRONIC DEVICES WITH REINFORCED LEAD CRACK AND METHOD OF MANUFACTURING THE SAME

摘要

Provided is a tap tape for electronic devices with lead crack and a method of manufacturing the tap tape. According to the present invention, by forming a cutting portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the cutting portion within a resin application portion and without being a bending portion, crack occurred in a narrow wiring width can be avoided. The tap tape may includes a first lead and a second lead formed on a dielectric substrate and a cutting portion formed on one of the first lead and the second lead wherein the cutting portion is formed within a resin application portion.