| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric device with excellent productivity. <P>SOLUTION: A piezoelectric element wafer 1, on which a plurality of piezoelectric elements 2 are integrally formed, is abutted against a base substrate 5, on the surface of which a junction member 6 such as a conductive adhesive is applied in advance. Under this condition, processing such as heat processing is appropriately performed, so that the junction member 6 is fused or solidified to join the piezoelectric elements 2 to the base substrate 5. Thereafter, the piezoelectric elements 2 are separated from the piezoelectric element wafer 1 by laser and the like, and only the piezoelectric elements 2 are left on the base substrate 5 as they are. The piezoelectric element wafer 1 in the other region is removed from the base substrate 5. <P>COPYRIGHT: (C)2012,JPO&INPIT |
