发明名称 RADIATION SENSITIVE RESIN COMPOSITION, CURED FILM, AND FORMING METHOD OF CURED FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition in which preservation stability and hardening by low temperature firing of a short time period are both achieved and which has sufficient sensitivity; and a cured film excellent in heat resistance, transmittance, and voltage retaining ratio. <P>SOLUTION: The radiation sensitive resin composition contains [A] a polymer having a structural unit comprising an epoxy group, [B] a polymeric compound including an ethylenically unsaturated bond, [C] a radiation-sensitive polymerization initiator, and [D] a compound including a cyanate group. Preferably, the [A] polymer further includes a structural unit comprising a carboxyl group. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012150180(A) 申请公布日期 2012.08.09
申请号 JP20110007265 申请日期 2011.01.17
申请人 JSR CORP 发明人 YONEDA EIJI;ICHINOHE DAIGO
分类号 G03F7/038;C08G59/40;G03F7/004;G03F7/40 主分类号 G03F7/038
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