| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for cleaning a wafer, which can evenly and uniformly clean a face of the wafer without being affected by attenuation of an ultrasonic wave and a nonuniform liquid current in a cleaning tank. <P>SOLUTION: The apparatus for cleaning a wafer comprises: the cleaning tank 11 filled with a cleaning liquid 2; a pedestal 12 which swingably holds the wafer 1 in the cleaning tank 11; and a wafer chuck 13 which moves the wafer 1 in a vertical direction while holding the wafer 1. In an operation for rotating the wafer 1, the wafer chuck 13 lifts the wafer 1 so that the wafer 1 is lifted from the pedestal 12 at a position at which a swing angle of the pedestal 12 becomes -θ, then only the pedestal 12 is rotated to tilt at an angle of +θ, the wafer chuck 13 releases the wafer 1, the wafer 1 is put on the pedestal 12 again and accordingly the wafer 1 is rotated in a circumferential direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
