| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide systems and methods for a micro-electromechanical system (MEMS) apparatus. <P>SOLUTION: In one embodiment, the system comprises a first double chip that includes a first base layer; a first device layer bonded to the first base layer, the first device layer comprising a first set of MEMS devices; and a first top layer bonded to the first device layer, wherein the first set of MEMS devices is hermetically isolated. The system also comprises a second double chip that includes a second base layer; a second device layer bonded to the second base layer, the second device layer comprising a second set of MEMS devices; and a second top layer bonded to the second device layer, wherein the second set of MEMS devices is hermetically isolated, wherein a first top surface of the first top layer is bonded to a second top surface of the second top layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
