发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF RESIST PATTERN, AND ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition developable with an aqueous alkaline solution, which has further improved sensitivity and resolution. <P>SOLUTION: A positive photosensitive resin composition contains (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound generating an acid with light, (C) an elastomer, (D) a low molecular weight compound having a phenolic hydroxyl group and (E) a solvent, where the (D) component is 2,2-bisä3,5-bis(hydroxymethyl)-4-hydroxyphenyl}-1,1,1,3,3,3-hexafluoropropane or 1,1-bisä3,5-bis(methoxymethyl)-4-hydroxyphenyl}methane. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012150508(A) 申请公布日期 2012.08.09
申请号 JP20120086785 申请日期 2012.04.05
申请人 HITACHI CHEM CO LTD 发明人 MATSUTANI HIROSHI;UENO TAKUMI;NICOLAS ALEXANDRE
分类号 G03F7/004;G03F7/023;H01L21/027 主分类号 G03F7/004
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