发明名称 |
THERMAL TREATMENT APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To improve temperature uniformity of a substrate and improve efficiency in a thermal treatment apparatus performing thermal treatment on the substrate by using induction heating. <P>SOLUTION: A thermal treatment apparatus 1 performing thermal treatment on a plurality of substrates S comprises: a processing chamber 22 of a dielectric for housing the plurality of substrates on which the thermal treatment is performed; a substrate holding member 24 inserted and removed from inside the processing chamber 22 while holding the plurality of substrates S arranged one above the other; an induction heating coil 104 wound around an outer periphery of the processing chamber 22; a high-frequency power source 110 for applying a high-frequency power to the induction heating coil 104; and an induction heating bodies N each provided in such a manner as to overlap each of the plurality of substrates S in the processing chamber 22 and having a spiral part in which induction current generated by application of the high-frequency power to the induction heating coil 104 flows and heat is generated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012151433(A) |
申请公布日期 |
2012.08.09 |
申请号 |
JP20110158647 |
申请日期 |
2011.07.20 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
SAWADA IKUO;HOSAKA SHIGETOSHI |
分类号 |
H01L21/324;C23C16/46;H01L21/31;H05B6/10;H05B6/40;H05B6/44 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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