| 摘要 |
<p>PURPOSE: A stacked semiconductor package and a manufacturing method thereof are provided to improve electrical and mechanical strength of the stacked semiconductor package by using a bump in the shape of a pillar. CONSTITUTION: A first semiconductor package(100) includes a first wiring layer(110), a first semiconductor chip(120), a first connection member(130) and a first molding member(140). The first connection member is formed between the first wiring layer and the first semiconductor chip. A second semiconductor package(200) includes a second wiring layer(210), a second semiconductor chip(230), a wire(240) and a second molding member(250). The second wiring layer includes a redistribution layer formed on a wafer level. The second molding member is formed with same material as the first molding member.</p> |
