| 摘要 |
The invention relates to a chip module, comprising an electrically insulating module carrier (3) having a first side and a second side and also electrically insulating material between the first and second sides, wherein the first side holds a chip (2) and the second side has an arrangement (1) comprising one or more electrically conductive contact areas (101, 102,..., 108) formed on it to which at least some of the chip (2) is connected. The chip module according to the invention is distinguished in that the first side of the module carrier (3) holds one or more electrically conductive elements (4) which are connected to the chip (2) to form an electric circuit. |
