Semiconductor circuit assembly

摘要

The arrangement (10) has a circuit substrate (14) including a housing (12) that is provided with semiconductor components (20) and arranged on a cooling body (24). The housing is formed with a pressure element (26), which includes a knob-shaped pressure body (28) to be made of material whose thermal expansion coefficient is larger than material of the housing. The housing is formed with hollow cavities (30) of the pressure body that is provided with a head section (32) from the hallow cavities. A metal insert is embedded in the housing and formed by a metallic sheet.