| 摘要 |
PURPOSE: A semiconductor device, a method of manufacturing thereof and an electronic device are provided to improve the connection reliability by preventing connection failures due to a displacement. CONSTITUTION: A semiconductor element(2) includes a first protruding electrode(2a). An electronic element(3) includes a second protruding electrode(3a). A substrate(4) is installed between the semiconductor element and the electronic element. The substrate has a through-hole(4a) in which the first and second protruding electrodes are fitted. |
