| 摘要 |
<p>To provide an IC device testing socket, capable of improving signal transmission efficiency during testing an IC device, without deteriorating the replacement workability of contact pins. A substrate 2 has dielectric layers 22-25 embedded in a base material 21 constituted by dielectric material such as glass epoxy. Each dielectric layer has a conductive layer, such as copper, formed on both sides thereof. Each of contact pins 3 extends generally perpendicular to surfaces 26 and 27 of substrate 2, and penetrates substrate 2. A through hole 28, into which each contact pin may be pressed, is formed in base material 21 of substrate 2, each high-dielectric layer and conductive layer. A conductive material 281, such as copper, is formed on an inner surface of each through hole 28.</p> |
