SEMICONDUCTOR PACKAGE HAVING DECOUPLING SEMICONDUCTOR CAPACITOR

摘要

PURPOSE: A semiconductor package having a decoupling semiconductor is provided to prevent an increase in resistance by forming a short bonding wire. CONSTITUTION: A package substrate(800) includes a first bond finger(810) and a second bond finger(860). A first semiconductor chip(100) is mounted on the package substrate. The first semiconductor chip includes a first chip pad and a second chip pad. The first decoupling semiconductor capacitor is mounted on the first semiconductor chip. The first decoupling semiconductor capacitor includes a first capacitor pad.