发明名称 |
SILICON ELECTRODE PLATE FOR PLASMA ETCHING |
摘要 |
PURPOSE: A silicon electrode plate for plasma etching is provided to suppress the occurrence of cracks by minimizing the unevenness of the surface during plasma etching. CONSTITUTION: A silicon electrode plate(12) is formed with a plurality of penetrated pores(5). A silicon wafer(4) is placed on a rack(3) in a vacuum vessel(1) of a plasma etching apparatus. A radio frequency voltage is applied between the silicon electrode plate and the rack by a radio frequency power source(6). A plasma(10) is generated in a space between the silicon electrode plate and the rack by applying the radio frequency voltage. The surface of the silicon wafer is etched through the physical reaction caused by the plasma.
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申请公布号 |
KR20120088595(A) |
申请公布日期 |
2012.08.08 |
申请号 |
KR20120009230 |
申请日期 |
2012.01.30 |
申请人 |
MITSUBISHI MATERIALS CORP. |
发明人 |
KOMEKYU TAKASHI;TAKABATAKE KOTA |
分类号 |
H01L21/3065 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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