发明名称 SILICON ELECTRODE PLATE FOR PLASMA ETCHING
摘要 PURPOSE: A silicon electrode plate for plasma etching is provided to suppress the occurrence of cracks by minimizing the unevenness of the surface during plasma etching. CONSTITUTION: A silicon electrode plate(12) is formed with a plurality of penetrated pores(5). A silicon wafer(4) is placed on a rack(3) in a vacuum vessel(1) of a plasma etching apparatus. A radio frequency voltage is applied between the silicon electrode plate and the rack by a radio frequency power source(6). A plasma(10) is generated in a space between the silicon electrode plate and the rack by applying the radio frequency voltage. The surface of the silicon wafer is etched through the physical reaction caused by the plasma.
申请公布号 KR20120088595(A) 申请公布日期 2012.08.08
申请号 KR20120009230 申请日期 2012.01.30
申请人 MITSUBISHI MATERIALS CORP. 发明人 KOMEKYU TAKASHI;TAKABATAKE KOTA
分类号 H01L21/3065 主分类号 H01L21/3065
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