发明名称 |
Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip |
摘要 |
A semiconductor element substrate includes an electrode pad; a semiconductor element; and a connection heater for heating the electrode pad, wherein the connection heater is disposed in a range capable of heating the electrode pad up to a level capable of electrical connection. |
申请公布号 |
US8235503(B2) |
申请公布日期 |
2012.08.07 |
申请号 |
US20080326381 |
申请日期 |
2008.12.02 |
申请人 |
NOJO NARUYUKI;CANON KABUSHIKI KAISHA |
发明人 |
NOJO NARUYUKI |
分类号 |
B41J2/01 |
主分类号 |
B41J2/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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