发明名称 |
Metal-ceramic multilayer structure |
摘要 |
A metal-ceramic multilayer structure is provided. The underlying layers of the metal/ceramic multilayer structure have sloped sidewalls such that cracking of the metal-ceramic multilayer structure may be reduced or eliminated. In an embodiment, a layer immediately underlying the metal-ceramic multilayer has sidewalls sloped less than 75 degrees. Subsequent layers underlying the layer immediately underlying the metal/ceramic layer have sidewalls sloped greater than 75 degrees. In this manner, less stress is applied to the overlying metal/ceramic layer, particularly in the corners, thereby reducing the cracking of the metal-ceramic multilayer. The metal/ceramic multilayer structure includes one or more alternating layers of a metal seed layer and a ceramic layer. |
申请公布号 |
US8237235(B2) |
申请公布日期 |
2012.08.07 |
申请号 |
US20100692118 |
申请日期 |
2010.01.22 |
申请人 |
WU TING-HAU;CHENG CHUN-REN;TSAI SHANG-YING;PENG JUNG-HUEI;LEE JIOU-KANG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WU TING-HAU;CHENG CHUN-REN;TSAI SHANG-YING;PENG JUNG-HUEI;LEE JIOU-KANG |
分类号 |
H01L29/84;H01L23/495 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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