发明名称 Metal-ceramic multilayer structure
摘要 A metal-ceramic multilayer structure is provided. The underlying layers of the metal/ceramic multilayer structure have sloped sidewalls such that cracking of the metal-ceramic multilayer structure may be reduced or eliminated. In an embodiment, a layer immediately underlying the metal-ceramic multilayer has sidewalls sloped less than 75 degrees. Subsequent layers underlying the layer immediately underlying the metal/ceramic layer have sidewalls sloped greater than 75 degrees. In this manner, less stress is applied to the overlying metal/ceramic layer, particularly in the corners, thereby reducing the cracking of the metal-ceramic multilayer. The metal/ceramic multilayer structure includes one or more alternating layers of a metal seed layer and a ceramic layer.
申请公布号 US8237235(B2) 申请公布日期 2012.08.07
申请号 US20100692118 申请日期 2010.01.22
申请人 WU TING-HAU;CHENG CHUN-REN;TSAI SHANG-YING;PENG JUNG-HUEI;LEE JIOU-KANG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 WU TING-HAU;CHENG CHUN-REN;TSAI SHANG-YING;PENG JUNG-HUEI;LEE JIOU-KANG
分类号 H01L29/84;H01L23/495 主分类号 H01L29/84
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