发明名称 Memory cell with silicon-containing carbon switching layer and methods for forming the same
摘要 In a first aspect, a method of forming a memory cell is provided that includes (1) forming a metal-insulator-metal (MIM) stack, the MIM stack including (a) a first conductive carbon layer; (b) a low-hydrogen, silicon-containing carbon layer above the first conductive carbon layer; and (c) a second conductive carbon layer above the low-hydrogen, silicon-containing carbon layer; and (2) forming a steering element coupled to the MIM stack. Numerous other aspects are provided.
申请公布号 US8237146(B2) 申请公布日期 2012.08.07
申请号 US20100711810 申请日期 2010.02.24
申请人 KREUPL FRANZ;ZHANG JINGYAN;XU HUIWEN;SANDISK 3D LLC 发明人 KREUPL FRANZ;ZHANG JINGYAN;XU HUIWEN
分类号 H01L47/00;H01L21/00;H01L21/02;H01L21/20;H01L27/108;H01L29/94 主分类号 H01L47/00
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