| 发明名称 |
Method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate |
| 摘要 |
A method of applying a pattern of metal, metal oxide, and/or semiconductor material on a substrate, a pattern created by that method, and uses of that pattern. |
| 申请公布号 |
US8236670(B2) |
申请公布日期 |
2012.08.07 |
| 申请号 |
US20070294434 |
申请日期 |
2007.03.26 |
| 申请人 |
WESSELS JURINA;YASUDA AKIO;KARIPIDOU ZOI;SCHREIBER AKOS;RIEDEL MARC;SCHWAAB DANIEL;MAYER DIRK;OFFENHAEUSSER ANDREAS;SONY DEUTSCHLAND GMBH;FORSCHUNGSZENTRUM JUELICH GMBH |
发明人 |
WESSELS JURINA;YASUDA AKIO;KARIPIDOU ZOI;SCHREIBER AKOS;RIEDEL MARC;SCHWAAB DANIEL;MAYER DIRK;OFFENHAEUSSER ANDREAS |
| 分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
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