| 摘要 |
<p>PURPOSE: A semiconductor memory chip and a multi chip package using the same are provided to constantly load a signal transmitted through a bonding for connecting semiconductor memory chips to pads of the multi chip package. CONSTITUTION: A first data signal, a first strobe signal, and a first mask signal are inputted to a first pad unit(61). A first selection transmitting unit(71) transmits a first data signal, a first strobe signal, and a first mask signal to a first write path circuit in a first mode and transmits the first data signal, the first strobe signal, and the first mask signal to a second write path circuit in an exchange mode. A second data signal, a second strobe signal, and a second mask signal are inputted to a second pad unit(62). A second selection transmitting unit(72) transmits a second data signal, a second strobe signal, and a second mask signal to a second write path circuit.</p> |
