PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE SOLDER RESIST COMPOSITION, PHOTOSENSITIVE SOLDER RESIST FILM, AND PERMANENT PATTERN, METHOD FOR FORMING SAME, AND PRINTED SUBSTRATE

摘要

Disclosed is a photosensitive composition that contains an inorganic filler, a polymerizable compound, a photopolymerization initiator, and a polyurethane resin containing an acid modified vinyl group, and the aforementioned inorganic filler contains silica particles wherein the average particle diameter (d50) is 0.2 �m-3.0 �m.