| 摘要 |
[Problem] To provide a divided sputtering target obtained by joining a plurality of target members, whereby it is possible to effectively prevent the contamination of grown thin films by the material constituting a backing plate as a result of sputtering. [Solution] The present invention is a divided sputtering target obtained by joining a plurality of target members on a backing plate by low-temperature soldering, characterized in that ceramic material or organic material is filled into gaps formed between the joined target members. Moreover, the ceramic material should preferably be a ceramic powder or ceramic fibers having the same composition as the target member, and it is preferable that the organic material is a substance with high resistance. |
