| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition capable of providing a cured film which is free from surface tackiness, is excellent in heat resistance, and hardly causes crack even when used at high temperature for a long time. <P>SOLUTION: The silicon-containing curable resin composition includes: an epoxysiloxane compound having at least two epoxy-containing groups and a group represented by general formula (1) in one molecule as a component (A); an epoxy siloxane compound having 1-10 silicon atoms and at least two epoxy-containing group in one molecule as a component (B); and an epoxy curable compound as a component (C). In general formula (1), R<SP POS="POST">1</SP>-R<SP POS="POST">4</SP>, which may be the same or different, each represent 1-4C alkyl or 6-10C aryl, and a represents an integer of 20-10,000. <P>COPYRIGHT: (C)2012,JPO&INPIT |
