| 摘要 |
<p>Provided is a technology of effectively preventing breakage, chipping and cracks from being generated in a circuit board. In an electronic component (1), which is provided with a circuit board (2) having a rectangular shape in planar view, said circuit board having electrodes for mounting (3, 3a) formed thereon, among the electrodes for mounting (3, 3a) formed on the rear surface (2a) of the circuit board (2) that is provided in the electronic component (1), electrodes for mounting (3a) close to the four corner portions of the circuit board (2) are disposed at positions shifted from the diagonal lines of the rear surface (2a), on the basis of results obtained by repeatedly analyzing stress generated in the circuit board (2) due to having a shock applied thereto from the outside. Therefore, stress generated close to the four corner portions of the circuit board (2) is reduced, and breakage, chipping and cracks are effectively prevented from being generated in the circuit board (2).</p> |
