Method of manufacturing back contact of e.g. solar cell, involves thermally spraying materials containing metal or alloy on back layer of wafer to form lower and upper layers, where materials have different melting temperatures

摘要

The method involves thermally spraying aluminum on back layer of crystalline silicon wafer (16) to form an aluminum layer (18) such that aluminum is applied over the entire surface of back layer. Materials containing metal or alloy are thermally sprayed on the back layer to form lower and upper layers (12,14), where the materials have different melting temperatures. The back layer is plated with tin. An independent claim is included for semiconductor device.