发明名称 PRINTED CIRCUIT BOARD
摘要 <p>A multi- layer printed circuit board (1) includes an embedded capacitor substrate composed of a power source conductor layer (4) and a ground conductor layer (3), the layers being disposed close to each other. The power source conductor layer has a first power source plane (8) to supply power to a circuit element, and a second power source plane (7) that is separated from the first power source plane by a gap ( 9 ) and functions as a main power source. The first power source plane is partially connected to the second power source plane by a connecting line (10). The ground conductor layer has an opening (12) at a position overlapping with a projected image when the connecting line is projected on the ground conductor layer. This structure suppresses propagation of the noise caused at the circuit element and reduces radiation noise in the printed circuit board.</p>
申请公布号 WO2012039120(A4) 申请公布日期 2012.08.02
申请号 WO2011JP05246 申请日期 2011.09.16
申请人 CANON KABUSHIKI KAISHA;MIYAZAKI, TOYOHIDE;KOYAMA, KENJI 发明人 MIYAZAKI, TOYOHIDE;KOYAMA, KENJI
分类号 H05K1/02;H01L23/66;H01L25/065;H05K1/16 主分类号 H05K1/02
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