| 摘要 |
PURPOSE: A liquid processing apparatus and a liquid processing method are provided to uniformly place the lower side of a substrate with IPA by discharging mist with the IPA and N2 gas to the lower side of the substrate using a nozzle. CONSTITUTION: A holding plate(30) holds a wafer(W). A lift pin plate(20) includes a lift pin(22) which downwardly supports the wafer. A rotation driving unit(39) includes an electric motor which rotates the holding plate. A processing fluid supply pipe(40) passes through a penetration hole(30a) formed on the maintaining plate. A nozzle(60) sprays the processing fluid supplied through the processing fluid supply pipe to the lower side of the wafer.
|
