| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder inspection method, a solder inspection machine, and a board inspection system that highly accurately estimate the characteristics of a portion whose condition is hard to determine via images shot during a solder printing inspection, and enhance the inspection accuracy of the solder condition by means of a determination process that takes into account the result of the estimation. <P>SOLUTION: A solder printing inspection machine 10 inspects a cream solder on a land of a board by measuring the volume of the cream solder, and sends information on the inspection result containing a measurement value to an inspection data management device 102. A solder inspection machine 30 detects characteristic data of a soldered portion to be inspected from images of the board as of after a reflow and, through communication with the inspection data management device 102, obtains the volume of the cream solder that has been gained by the measurement of a portion corresponding to the soldered portion to be inspected conducted by the solder printing inspection machine 10. Then, using the obtained volume, the solder inspection machine estimates the characteristics of a portion in the proximity of a part, whose characteristics data are hard to measure, calculates the height of a wet solder as of after the reflow by supplementing the characteristic data with the result of the estimation, and determines whether the height is proper or not. <P>COPYRIGHT: (C)2012,JPO&INPIT |
